Silke H. Christiansen, Rajendra Singh, Ulrich Gosele. Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics. Proceedings of the IEEE, 94(12):2060-2106, 2006. [doi]
@article{ChristiansenSG06,
title = {Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics},
author = {Silke H. Christiansen and Rajendra Singh and Ulrich Gosele},
year = {2006},
doi = {10.1109/JPROC.2006.886026},
url = {https://doi.org/10.1109/JPROC.2006.886026},
researchr = {https://researchr.org/publication/ChristiansenSG06},
cites = {0},
citedby = {0},
journal = {Proceedings of the IEEE},
volume = {94},
number = {12},
pages = {2060-2106},
}