Thermal Flattening in 3D FPGAs Using Embedded Cooling (Abstract Only)

Girish Deshpande, Dinesh Bhatia. Thermal Flattening in 3D FPGAs Using Embedded Cooling (Abstract Only). In Jonathan W. Greene, Jason Helge Anderson, editors, Proceedings of the 2017 ACM/SIGDA International Symposium on Field-Programmable Gate Arrays, FPGA 2017, Monterey, CA, USA, February 22-24, 2017. pages 286, ACM, 2017. [doi]

Abstract

Abstract is missing.