Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes. Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-7, IEEE, 2023. [doi]
Abstract is missing.