On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC - researchr publication authors

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Sheng-Hsin Fang, Chang-Tzu Lin, Wei-Hsun Liao, Chien-Chia Huang, Li-Chin Chen, Hung-Ming Chen, I-Hsuan Lee, Ding-Ming Kwai, Yung-Fa Chou. On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC. In 2017 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2017, Bochum, Germany, July 3-5, 2017. pages 459-464, IEEE, 2017. [doi]

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