Sheng-Hsin Fang, Chang-Tzu Lin, Wei-Hsun Liao, Chien-Chia Huang, Li-Chin Chen, Hung-Ming Chen, I-Hsuan Lee, Ding-Ming Kwai, Yung-Fa Chou. On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC. In 2017 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2017, Bochum, Germany, July 3-5, 2017. pages 459-464, IEEE, 2017. [doi]
@inproceedings{FangLLHCCLKC17,
title = {On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC},
author = {Sheng-Hsin Fang and Chang-Tzu Lin and Wei-Hsun Liao and Chien-Chia Huang and Li-Chin Chen and Hung-Ming Chen and I-Hsuan Lee and Ding-Ming Kwai and Yung-Fa Chou},
year = {2017},
doi = {10.1109/ISVLSI.2017.86},
url = {https://doi.org/10.1109/ISVLSI.2017.86},
researchr = {https://researchr.org/publication/FangLLHCCLKC17},
cites = {0},
citedby = {0},
pages = {459-464},
booktitle = {2017 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2017, Bochum, Germany, July 3-5, 2017},
publisher = {IEEE},
isbn = {978-1-5090-6762-6},
}