A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication

Ramin Farjadrad, Bapiraju Vinnakota. A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication. In 2019 IEEE Symposium on High-Performance Interconnects, HOTI 2019, Santa Clara, CA, USA, August 14-16, 2019. pages 27-273, IEEE, 2019. [doi]

Authors

Ramin Farjadrad

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Bapiraju Vinnakota

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