Ramin Farjadrad, Bapiraju Vinnakota. A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication. In 2019 IEEE Symposium on High-Performance Interconnects, HOTI 2019, Santa Clara, CA, USA, August 14-16, 2019. pages 27-273, IEEE, 2019. [doi]
Abstract is missing.