Ramin Farjadrad, Bapiraju Vinnakota. A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication. In 2019 IEEE Symposium on High-Performance Interconnects, HOTI 2019, Santa Clara, CA, USA, August 14-16, 2019. pages 27-273, IEEE, 2019. [doi]
@inproceedings{FarjadradV19, title = {A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication}, author = {Ramin Farjadrad and Bapiraju Vinnakota}, year = {2019}, doi = {10.1109/HOTI.2019.00020}, url = {https://doi.org/10.1109/HOTI.2019.00020}, researchr = {https://researchr.org/publication/FarjadradV19}, cites = {0}, citedby = {0}, pages = {27-273}, booktitle = {2019 IEEE Symposium on High-Performance Interconnects, HOTI 2019, Santa Clara, CA, USA, August 14-16, 2019}, publisher = {IEEE}, isbn = {978-1-7281-5525-8}, }