Ramin Farjadrad, Bapiraju Vinnakota. A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication. In 2019 IEEE Symposium on High-Performance Interconnects, HOTI 2019, Santa Clara, CA, USA, August 14-16, 2019. pages 27-273, IEEE, 2019. [doi]
@inproceedings{FarjadradV19,
title = {A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication},
author = {Ramin Farjadrad and Bapiraju Vinnakota},
year = {2019},
doi = {10.1109/HOTI.2019.00020},
url = {https://doi.org/10.1109/HOTI.2019.00020},
researchr = {https://researchr.org/publication/FarjadradV19},
cites = {0},
citedby = {0},
pages = {27-273},
booktitle = {2019 IEEE Symposium on High-Performance Interconnects, HOTI 2019, Santa Clara, CA, USA, August 14-16, 2019},
publisher = {IEEE},
isbn = {978-1-7281-5525-8},
}