Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias - researchr publication related

researchr

You are not signed in
Sign in
Sign up

Alain Fourmigue, Giovanni Beltrame, Gabriela Nicolescu. Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias. In Design, Automation & Test in Europe Conference & Exhibition, DATE 2014, Dresden, Germany, March 24-28, 2014. pages 1-6, IEEE, 2014. [doi]

The following publications are possibly variants of this publication:

A linear-time approach for the transient thermal simulation of liquid-cooled 3d icsAlain Fourmigue, Giovanni Beltrame, Gabriela Nicolescu, El Mostapha Aboulhamid. codes 2011: 197-206 [doi]

Explicit transient thermal simulation of liquid-cooled 3D ICsAlain Fourmigue, Giovanni Beltrame, Gabriela Nicolescu. date 2013: 1385-1390 [doi]

runs on WebDSL