Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for Densely Packed FPGA Processing Boards

Paulina Fusiara, Gijs Schoonderbeek, Johan Pragt, Leon Hiemstra, Sjouke Kuindersma, Menno Schuil, Grant Hampson. Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for Densely Packed FPGA Processing Boards. In David Andrews, René Cumplido, Claudia Feregrino, Dirk Stroobandt, editors, 2018 International Conference on ReConFigurable Computing and FPGAs, ReConFig 2018, Cancun, Mexico, December 3-5, 2018. pages 1-8, IEEE, 2018. [doi]

Abstract

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