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Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers

Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto. Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]

Authors

Masahide Goto

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Kei Hagiwara

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Yoshinori Iguchi

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Hiroshi Ohtake

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Takuya Saraya

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Masaharu Kobayashi

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Eiji Higurashi

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Hiroshi Toshiyoshi

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Toshiro Hiramoto

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