Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto. Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
@inproceedings{GotoHIOSKHTH15,
title = {Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers},
author = {Masahide Goto and Kei Hagiwara and Yoshinori Iguchi and Hiroshi Ohtake and Takuya Saraya and Masaharu Kobayashi and Eiji Higurashi and Hiroshi Toshiyoshi and Toshiro Hiramoto},
year = {2015},
doi = {10.1109/3DIC.2015.7334562},
url = {http://dx.doi.org/10.1109/3DIC.2015.7334562},
researchr = {https://researchr.org/publication/GotoHIOSKHTH15},
cites = {0},
citedby = {0},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015},
publisher = {IEEE},
isbn = {978-1-4673-9385-0},
}