Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package - researchr publication authors

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Yong Han, Boon Long Lau, Boo Yang Jung, Xiaowu Zhang. Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package. IEEE Design & Test of Computers, 32(4):32-39, 2015. [doi]

This author has not been identified. Look up 'Yong Han' in GoogleThis author has not been identified. Look up 'Boon Long Lau' in GoogleThis author has not been identified. Look up 'Boo Yang Jung' in GoogleThis author has not been identified. Look up 'Xiaowu Zhang' in Google

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