Yong Han, Boon Long Lau, Boo Yang Jung, Xiaowu Zhang. Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package. IEEE Design & Test of Computers, 32(4):32-39, 2015. [doi]
@article{HanLJZ15,
title = {Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package},
author = {Yong Han and Boon Long Lau and Boo Yang Jung and Xiaowu Zhang},
year = {2015},
doi = {10.1109/MDAT.2015.2440414},
url = {http://dx.doi.org/10.1109/MDAT.2015.2440414},
researchr = {https://researchr.org/publication/HanLJZ15},
cites = {0},
citedby = {0},
journal = {IEEE Design & Test of Computers},
volume = {32},
number = {4},
pages = {32-39},
}