Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package

Yong Han, Boon Long Lau, Boo Yang Jung, Xiaowu Zhang. Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package. IEEE Design & Test of Computers, 32(4):32-39, 2015. [doi]

Abstract

Abstract is missing.