Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch. In 2013 IEEE International Test Conference, ITC 2013, Anaheim, CA, USA, September 6-13, 2013. pages 1-10, IEEE Computer Society, 2013. [doi]
@inproceedings{HsuCHLLLPW13,
title = {Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch},
author = {Sen-Kuei Hsu and Hao Chen and Chung-Han Huang and Der-Jiann Liu and Wei-Hsun Lin and Hung-Chih Lin and Ching-Nen Peng and Min-Jer Wang},
year = {2013},
doi = {10.1109/TEST.2013.6651888},
url = {http://doi.ieeecomputersociety.org/10.1109/TEST.2013.6651888},
researchr = {https://researchr.org/publication/HsuCHLLLPW13},
cites = {0},
citedby = {0},
pages = {1-10},
booktitle = {2013 IEEE International Test Conference, ITC 2013, Anaheim, CA, USA, September 6-13, 2013},
publisher = {IEEE Computer Society},
}