Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch. In 2013 IEEE International Test Conference, ITC 2013, Anaheim, CA, USA, September 6-13, 2013. pages 1-10, IEEE Computer Society, 2013. [doi]
Abstract is missing.