Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM Journal of Research and Development, 39(4):465-498, 1995.

Authors

Chao-Kun Hu

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Kenneth P. Rodbell

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Timothy D. Sullivan

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Kim Y. Lee

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Dennis P. Bouldin

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