Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM Journal of Research and Development, 39(4):465-498, 1995.
@article{HuRSLB95,
title = {Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines},
author = {Chao-Kun Hu and Kenneth P. Rodbell and Timothy D. Sullivan and Kim Y. Lee and Dennis P. Bouldin},
year = {1995},
researchr = {https://researchr.org/publication/HuRSLB95},
cites = {0},
citedby = {0},
journal = {IBM Journal of Research and Development},
volume = {39},
number = {4},
pages = {465-498},
}