Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM Journal of Research and Development, 39(4):465-498, 1995.

Abstract

Abstract is missing.