Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package - researchr publication authors

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Yu-Chieh Huang, Bing-Yang Lin, Cheng-Wen Wu, Mincent Lee, Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package. In Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, Austin, TX, USA, June 5-9, 2016. pages 58, ACM, 2016. [doi]

This author has not been identified. Look up 'Yu-Chieh Huang' in GoogleThis author has not been identified. Look up 'Bing-Yang Lin' in GoogleThis author has not been identified. Look up 'Cheng-Wen Wu' in GoogleThis author has not been identified. Look up 'Mincent Lee' in GoogleThis author has not been identified. It may be one of the following persons:

Hao Chen

Look up 'Hao Chen' in GoogleThis author has not been identified. Look up 'Hung-Chih Lin' in GoogleThis author has not been identified. Look up 'Ching-Nen Peng' in GoogleThis author has not been identified. Look up 'Min-Jer Wang' in Google

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