Yu-Chieh Huang, Bing-Yang Lin, Cheng-Wen Wu, Mincent Lee, Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package. In Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, Austin, TX, USA, June 5-9, 2016. pages 58, ACM, 2016. [doi]
@inproceedings{HuangLWLCLPW16,
title = {Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package},
author = {Yu-Chieh Huang and Bing-Yang Lin and Cheng-Wen Wu and Mincent Lee and Hao Chen and Hung-Chih Lin and Ching-Nen Peng and Min-Jer Wang},
year = {2016},
doi = {10.1145/2897937.2898015},
url = {http://doi.acm.org/10.1145/2897937.2898015},
researchr = {https://researchr.org/publication/HuangLWLCLPW16},
cites = {0},
citedby = {0},
pages = {58},
booktitle = {Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, Austin, TX, USA, June 5-9, 2016},
publisher = {ACM},
isbn = {978-1-4503-4236-0},
}