A. Ikeda, L. J. Qiu, K. Nakahara, T. Asano. Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]
@inproceedings{IkedaQNA13,
title = {Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding},
author = {A. Ikeda and L. J. Qiu and K. Nakahara and T. Asano},
year = {2013},
doi = {10.1109/3DIC.2013.6702317},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702317},
researchr = {https://researchr.org/publication/IkedaQNA13},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}