A flexible multi-standard I/O interface for chip-to-chip links in 65 nm CMOS

Joscha Ilmberger, Niels Fiedler, Andreas GrĂ¼bl, Johannes Schemmel. A flexible multi-standard I/O interface for chip-to-chip links in 65 nm CMOS. In IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2024, Taipei, Taiwan, November 7-9, 2024. pages 424-427, IEEE, 2024. [doi]

Abstract

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