Thermal management challenges and mitigation techniques for transistor-level 3-D integration

Md Arif Iqbal, Naveen Kumar Macha, Wafi Danesh, Sehtab Hossain, Mostafizur Rahman. Thermal management challenges and mitigation techniques for transistor-level 3-D integration. Microelectronics Journal, 91:61-69, 2019. [doi]

Authors

Md Arif Iqbal

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Naveen Kumar Macha

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Wafi Danesh

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Sehtab Hossain

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Mostafizur Rahman

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