Md Arif Iqbal, Naveen Kumar Macha, Wafi Danesh, Sehtab Hossain, Mostafizur Rahman. Thermal management challenges and mitigation techniques for transistor-level 3-D integration. Microelectronics Journal, 91:61-69, 2019. [doi]
@article{IqbalMDHR19,
title = {Thermal management challenges and mitigation techniques for transistor-level 3-D integration},
author = {Md Arif Iqbal and Naveen Kumar Macha and Wafi Danesh and Sehtab Hossain and Mostafizur Rahman},
year = {2019},
doi = {10.1016/j.mejo.2019.07.004},
url = {https://doi.org/10.1016/j.mejo.2019.07.004},
researchr = {https://researchr.org/publication/IqbalMDHR19},
cites = {0},
citedby = {0},
journal = {Microelectronics Journal},
volume = {91},
pages = {61-69},
}