Thermal management challenges and mitigation techniques for transistor-level 3-D integration

Md Arif Iqbal, Naveen Kumar Macha, Wafi Danesh, Sehtab Hossain, Mostafizur Rahman. Thermal management challenges and mitigation techniques for transistor-level 3-D integration. Microelectronics Journal, 91:61-69, 2019. [doi]

Abstract

Abstract is missing.