Modeling and characterization of molding compound properties during cure - researchr publication authors

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Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, H. Preu, M. Stecher. Modeling and characterization of molding compound properties during cure. Microelectronics Reliability, 49(8):872-876, 2009. [doi]

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