Modeling and characterization of molding compound properties during cure

Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, H. Preu, M. Stecher. Modeling and characterization of molding compound properties during cure. Microelectronics Reliability, 49(8):872-876, 2009. [doi]

Abstract

Abstract is missing.