Modeling and characterization of molding compound properties during cure

Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, H. Preu, M. Stecher. Modeling and characterization of molding compound properties during cure. Microelectronics Reliability, 49(8):872-876, 2009. [doi]

Possibly Related Publications

The following publications are possibly variants of this publication: