Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, H. Preu, M. Stecher. Modeling and characterization of molding compound properties during cure. Microelectronics Reliability, 49(8):872-876, 2009. [doi]
@article{JansenQEBKPS09,
title = {Modeling and characterization of molding compound properties during cure},
author = {Kaspar M. B. Jansen and C. Qian and Leo J. Ernst and C. Bohm and A. Kessler and H. Preu and M. Stecher},
year = {2009},
doi = {10.1016/j.microrel.2009.03.007},
url = {http://dx.doi.org/10.1016/j.microrel.2009.03.007},
tags = {modeling, C++},
researchr = {https://researchr.org/publication/JansenQEBKPS09},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {49},
number = {8},
pages = {872-876},
}