A novel TSV probing technique with adhesive test interposer - researchr publication authors

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Li Jiang, Xiangwei Huang, Hongfeng Xie, Qiang Xu, Chao Li, Xiaoyao Liang, Huiyun Li. A novel TSV probing technique with adhesive test interposer. In 33rd IEEE International Conference on Computer Design, ICCD 2015, New York City, NY, USA, October 18-21, 2015. pages 597-604, IEEE Computer Society, 2015. [doi]

This author has not been identified. Look up 'Li Jiang' in GoogleThis author has not been identified. Look up 'Xiangwei Huang' in GoogleThis author has not been identified. Look up 'Hongfeng Xie' in GoogleThis author has not been identified. Look up 'Qiang Xu' in GoogleThis author has not been identified. Look up 'Chao Li' in GoogleThis author has not been identified. Look up 'Xiaoyao Liang' in GoogleThis author has not been identified. Look up 'Huiyun Li' in Google

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