Li Jiang, Xiangwei Huang, Hongfeng Xie, Qiang Xu, Chao Li, Xiaoyao Liang, Huiyun Li. A novel TSV probing technique with adhesive test interposer. In 33rd IEEE International Conference on Computer Design, ICCD 2015, New York City, NY, USA, October 18-21, 2015. pages 597-604, IEEE Computer Society, 2015. [doi]
@inproceedings{JiangHXXLLL15,
title = {A novel TSV probing technique with adhesive test interposer},
author = {Li Jiang and Xiangwei Huang and Hongfeng Xie and Qiang Xu and Chao Li and Xiaoyao Liang and Huiyun Li},
year = {2015},
doi = {10.1109/ICCD.2015.7357170},
url = {http://doi.ieeecomputersociety.org/10.1109/ICCD.2015.7357170},
researchr = {https://researchr.org/publication/JiangHXXLLL15},
cites = {0},
citedby = {0},
pages = {597-604},
booktitle = {33rd IEEE International Conference on Computer Design, ICCD 2015, New York City, NY, USA, October 18-21, 2015},
publisher = {IEEE Computer Society},
isbn = {978-1-4673-7166-7},
}