Li Jiang, Xiangwei Huang, Hongfeng Xie, Qiang Xu, Chao Li, Xiaoyao Liang, Huiyun Li. A novel TSV probing technique with adhesive test interposer. In 33rd IEEE International Conference on Computer Design, ICCD 2015, New York City, NY, USA, October 18-21, 2015. pages 597-604, IEEE Computer Society, 2015. [doi]
Abstract is missing.