Dae-Hyun Kim, Krit Athikulwongse, Sung Kyu Lim. A study of Through-Silicon-Via impact on the 3D stacked IC layout. In 2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA. pages 674-680, IEEE, 2009. [doi]
@inproceedings{KimAL09,
title = {A study of Through-Silicon-Via impact on the 3D stacked IC layout},
author = {Dae-Hyun Kim and Krit Athikulwongse and Sung Kyu Lim},
year = {2009},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5361224},
tags = {layout},
researchr = {https://researchr.org/publication/KimAL09},
cites = {0},
citedby = {0},
pages = {674-680},
booktitle = {2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA},
publisher = {IEEE},
}