Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration - researchr publication authors

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Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Majid Ahadi Dolatsara, Hakki Mert Torun, Madhavan Swaminathan, Saibal Mukhopadhyay, Sung Kyu Lim. Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration. In 38th IEEE International Conference on Computer Design, ICCD 2020, Hartford, CT, USA, October 18-21, 2020. pages 80-87, IEEE, 2020. [doi]

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