Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Majid Ahadi Dolatsara, Hakki Mert Torun, Madhavan Swaminathan, Saibal Mukhopadhyay, Sung Kyu Lim. Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration. In 38th IEEE International Conference on Computer Design, ICCD 2020, Hartford, CT, USA, October 18-21, 2020. pages 80-87, IEEE, 2020. [doi]
@inproceedings{KimCRDTSML20,
title = {Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration},
author = {Jinwoo Kim and Venkata Chaitanya Krishna Chekuri and Nael Mizanur Rahman and Majid Ahadi Dolatsara and Hakki Mert Torun and Madhavan Swaminathan and Saibal Mukhopadhyay and Sung Kyu Lim},
year = {2020},
doi = {10.1109/ICCD50377.2020.00030},
url = {https://doi.org/10.1109/ICCD50377.2020.00030},
researchr = {https://researchr.org/publication/KimCRDTSML20},
cites = {0},
citedby = {0},
pages = {80-87},
booktitle = {38th IEEE International Conference on Computer Design, ICCD 2020, Hartford, CT, USA, October 18-21, 2020},
publisher = {IEEE},
isbn = {978-1-7281-9710-4},
}