Tihomir Knezevic, Tomislav Suligoj, Xingyu Liu, Lis K. Nanver, Ahmed ElSayed, Jan F. Dick, Jörg Schulze. Back-end-of-line CMOS-compatible diode fabrication with pure boron deposition down to 50 °C. In 49th European Solid-State Device Research Conference, ESSDERC 2019, Cracow, Poland, September 23-26, 2019. pages 242-245, IEEE, 2019. [doi]
@inproceedings{KnezevicSLNEDS19,
title = {Back-end-of-line CMOS-compatible diode fabrication with pure boron deposition down to 50 °C},
author = {Tihomir Knezevic and Tomislav Suligoj and Xingyu Liu and Lis K. Nanver and Ahmed ElSayed and Jan F. Dick and Jörg Schulze},
year = {2019},
doi = {10.1109/ESSDERC.2019.8901810},
url = {https://doi.org/10.1109/ESSDERC.2019.8901810},
researchr = {https://researchr.org/publication/KnezevicSLNEDS19},
cites = {0},
citedby = {0},
pages = {242-245},
booktitle = {49th European Solid-State Device Research Conference, ESSDERC 2019, Cracow, Poland, September 23-26, 2019},
publisher = {IEEE},
isbn = {978-1-7281-1539-9},
}