Yield Enhancement by Repair Circuits for Ultra-Fine Pitch Stacked-Chip Connections

Keitaro Koga, Hiromitsu Awano, Makoto Ikeda. Yield Enhancement by Repair Circuits for Ultra-Fine Pitch Stacked-Chip Connections. In 26th IEEE Asian Test Symposium, ATS 2017, Taipei City, Taiwan, November 27-30, 2017. pages 201-205, IEEE Computer Society, 2017. [doi]

@inproceedings{KogaAI17,
  title = {Yield Enhancement by Repair Circuits for Ultra-Fine Pitch Stacked-Chip Connections},
  author = {Keitaro Koga and Hiromitsu Awano and Makoto Ikeda},
  year = {2017},
  doi = {10.1109/ATS.2017.46},
  url = {http://doi.ieeecomputersociety.org/10.1109/ATS.2017.46},
  researchr = {https://researchr.org/publication/KogaAI17},
  cites = {0},
  citedby = {0},
  pages = {201-205},
  booktitle = {26th IEEE Asian Test Symposium, ATS 2017, Taipei City, Taiwan, November 27-30, 2017},
  publisher = {IEEE Computer Society},
  isbn = {978-1-5386-2437-1},
}