First integration of Cu TSV using die-to-wafer direct bonding and planarization - researchr publication authors

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Patrick Leduc, Myriam Assous, LÃ©a Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon. First integration of Cu TSV using die-to-wafer direct bonding and planarization. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]

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