Chip scale packaging with surface mountable solder ball terminals for microsensors - researchr publication authors

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Ahra Lee, SangChul Lee, Sungsik Lee, Chang Han Je, Sunghae Jung, Myoung-Lae Lee, Gunn Hwang, Byoung Gon Yu, Chang-Auck Choi. Chip scale packaging with surface mountable solder ball terminals for microsensors. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009. pages 612-615, IEEE, 2009. [doi]

This author has not been identified. Look up 'Ahra Lee' in GoogleThis author has not been identified. Look up 'SangChul Lee' in GoogleThis author has not been identified. Look up 'Sungsik Lee' in GoogleThis author has not been identified. Look up 'Chang Han Je' in GoogleThis author has not been identified. Look up 'Sunghae Jung' in GoogleThis author has not been identified. Look up 'Myoung-Lae Lee' in GoogleThis author has not been identified. Look up 'Gunn Hwang' in GoogleThis author has not been identified. Look up 'Byoung Gon Yu' in GoogleThis author has not been identified. Look up 'Chang-Auck Choi' in Google

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