Ahra Lee, SangChul Lee, Sungsik Lee, Chang Han Je, Sunghae Jung, Myoung-Lae Lee, Gunn Hwang, Byoung Gon Yu, Chang-Auck Choi. Chip scale packaging with surface mountable solder ball terminals for microsensors. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009. pages 612-615, IEEE, 2009. [doi]
@inproceedings{LeeLLJJLHYC09,
title = {Chip scale packaging with surface mountable solder ball terminals for microsensors},
author = {Ahra Lee and SangChul Lee and Sungsik Lee and Chang Han Je and Sunghae Jung and Myoung-Lae Lee and Gunn Hwang and Byoung Gon Yu and Chang-Auck Choi},
year = {2009},
doi = {10.1109/NEMS.2009.5068655},
url = {http://doi.ieeecomputersociety.org/10.1109/NEMS.2009.5068655},
researchr = {https://researchr.org/publication/LeeLLJJLHYC09},
cites = {0},
citedby = {0},
pages = {612-615},
booktitle = {4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009},
publisher = {IEEE},
isbn = {978-1-4244-4629-2},
}