Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

K. W. Lee, C. Nagai, A. Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi. Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-4, IEEE, 2014. [doi]

This author has not been identified. Look up 'K. W. Lee' in GoogleThis author has not been identified. Look up 'C. Nagai' in GoogleThis author has not been identified. Look up 'A. Nakamura' in GoogleThis author has not been identified. Look up 'Ji Chel Bea' in GoogleThis author has not been identified. Look up 'Mariappan Murugesan' in GoogleThis author has not been identified. Look up 'Takafumi Fukushima' in GoogleThis author has not been identified. Look up 'Tetsu Tanaka' in GoogleThis author has not been identified. Look up 'Mitsumasa Koyanagi' in Google

runs on WebDSL