Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV

K. W. Lee, C. Nagai, A. Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi. Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-4, IEEE, 2014. [doi]

Abstract

Abstract is missing.