K. W. Lee, C. Nagai, A. Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi. Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-4, IEEE, 2014. [doi]
@inproceedings{LeeNNBMFTK14,
title = {Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV},
author = {K. W. Lee and C. Nagai and A. Nakamura and Ji Chel Bea and Mariappan Murugesan and Takafumi Fukushima and Tetsu Tanaka and Mitsumasa Koyanagi},
year = {2014},
doi = {10.1109/3DIC.2014.7152153},
url = {http://dx.doi.org/10.1109/3DIC.2014.7152153},
researchr = {https://researchr.org/publication/LeeNNBMFTK14},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014},
publisher = {IEEE},
isbn = {978-1-4799-8472-5},
}