Automatic Inspection for Wafer Defect Pattern Recognition with Unsupervised Clustering

Katherine Shu-Min Li, Leon Li-Yang Chen, Ken Chau-Cheung Cheng, Peter Yi-Yu Liao, Sying-Jyan Wang, Andrew Yi-Ann Huang, Nova Cheng-Yen Tsai, Leon Chou, Gus Chang-Hung Han, Jwu E. Chen, Hsing-Chung Liang, Chun-Lung Hsu. Automatic Inspection for Wafer Defect Pattern Recognition with Unsupervised Clustering. In 26th IEEE European Test Symposium, ETS 2021, Bruges, Belgium, May 24-28, 2021. pages 1-2, IEEE, 2021. [doi]

@inproceedings{LiCCLWHTCHCLH21,
  title = {Automatic Inspection for Wafer Defect Pattern Recognition with Unsupervised Clustering},
  author = {Katherine Shu-Min Li and Leon Li-Yang Chen and Ken Chau-Cheung Cheng and Peter Yi-Yu Liao and Sying-Jyan Wang and Andrew Yi-Ann Huang and Nova Cheng-Yen Tsai and Leon Chou and Gus Chang-Hung Han and Jwu E. Chen and Hsing-Chung Liang and Chun-Lung Hsu},
  year = {2021},
  doi = {10.1109/ETS50041.2021.9465457},
  url = {https://doi.org/10.1109/ETS50041.2021.9465457},
  researchr = {https://researchr.org/publication/LiCCLWHTCHCLH21},
  cites = {0},
  citedby = {0},
  pages = {1-2},
  booktitle = {26th IEEE European Test Symposium, ETS 2021, Bruges, Belgium, May 24-28, 2021},
  publisher = {IEEE},
  isbn = {978-1-6654-1849-2},
}