Efficient Thermal via Planning Approach and Its Application in 3-D Floorplanning

Zhuoyuan Li, Xianlong Hong, Qiang Zhou, Shan Zeng, Jinian Bian, Wenjian Yu, Hannah Honghua Yang, Vijay Pitchumani, Chung-Kuan Cheng. Efficient Thermal via Planning Approach and Its Application in 3-D Floorplanning. IEEE Trans. on CAD of Integrated Circuits and Systems, 26(4):645-658, 2007. [doi]

Abstract

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