Jin-Fu Li, Cheng-Wen Wu, Cheng-Wen Wu, Masahiro Aoyagi, Meng-Fan Marvin Chang, Ding-Ming Kwai. Special session 4C: Hot topic 3D-IC design and test. In 31st IEEE VLSI Test Symposium, VTS 2013, Berkeley, CA, USA, April 29 - May 2, 2013. pages 1, IEEE Computer Society, 2013. [doi]
@inproceedings{LiWWACK13,
title = {Special session 4C: Hot topic 3D-IC design and test},
author = {Jin-Fu Li and Cheng-Wen Wu and Cheng-Wen Wu and Masahiro Aoyagi and Meng-Fan Marvin Chang and Ding-Ming Kwai},
year = {2013},
doi = {10.1109/VTS.2013.6548900},
url = {http://doi.ieeecomputersociety.org/10.1109/VTS.2013.6548900},
researchr = {https://researchr.org/publication/LiWWACK13},
cites = {0},
citedby = {0},
pages = {1},
booktitle = {31st IEEE VLSI Test Symposium, VTS 2013, Berkeley, CA, USA, April 29 - May 2, 2013},
publisher = {IEEE Computer Society},
isbn = {978-1-4673-5542-1},
}