Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer

Jinxing Liang, Liyuan Zhang, Ling Wang, Yuan Dong, Toshitsugu Ueda. Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer. Sensors, 15(9):22049-22059, 2015. [doi]

Authors

Jinxing Liang

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Liyuan Zhang

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Ling Wang

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Yuan Dong

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Toshitsugu Ueda

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