Jinxing Liang, Liyuan Zhang, Ling Wang, Yuan Dong, Toshitsugu Ueda. Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer. Sensors, 15(9):22049-22059, 2015. [doi]
@article{LiangZWDU15,
title = {Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer},
author = {Jinxing Liang and Liyuan Zhang and Ling Wang and Yuan Dong and Toshitsugu Ueda},
year = {2015},
doi = {10.3390/s150922049},
url = {http://dx.doi.org/10.3390/s150922049},
researchr = {https://researchr.org/publication/LiangZWDU15},
cites = {0},
citedby = {0},
journal = {Sensors},
volume = {15},
number = {9},
pages = {22049-22059},
}